Evatec Process Systems (CH)
SDS 231 Wafer Handling:
This double robot handling has been developed for the flexible cassette-to-cassette loading of an SDS 231 sputtering system. It allows to process 6- and 8-inch wafers which can be coated on either side. The wafers get masked, enabling a deposition with "edge exclusion”.
Key features:
- Automated cassette-to-cassette operation
- Mixed processing of 6 "and 8" wafers possible
- Masked deposition for edge exclusion
- Frontside and backside metallization
